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AZ 50XT Photoresist

AZ 50XT Photoresist

Detailed

Positive resist for developing plating and wafer bumping applications
  • 50 to 80 micron single coat capability. 120+micron double coat capability
  • 3 to 1 aspect ratio. Excellent sidewall profiles. Wide process latitude
  • Inorganic developer recommended
  • Compatible with existing thick film processes

 

Photoresist

100 Micron Copper studsAX 50XT

 75 Micron Film Thickness

AZ 50XT

100 Micron SnPb Studs AX 50XT 

75 Micron Film Thickness

 

FEATURES

  1. Excellent coating characteristics
  2. Excellent sidewall profiles
  3. Compatible with a wide variety of substrates
  4. Sensitive to g, h, and I-line
  5. wavelengths
  6. Stable
  7. Positive tone

 

BENEFITS

  1. Higher yields, reduced rework
  2. Straight plating profiles
  3. Works on Cu, Si, and Au
  4. substrates. Meets any application
  5. Fast photospeed. Works with popular steppers and contact aligners
  6. Wider process window
  7. Compatible with existing equipment and processes

AZ 50XT Spin Curve


TAG:  Photoresist
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