Rigid organic chip bonder Wen Hao chip technology limited independentdevelopment in Suzhou, PMMA, PC, hard plastics such as COC chip sealing,both at home and abroad the first hard plastic Microfluidic Chip processingequipment.
Features
1, the use of thermostatically controlled heating, precise temperaturecontrol, temperature sampling frequency of 0.1s
2, stainless steel work platforms, the upper and lower surface is flat,fast thermal conductivity, thermal uniformity
3, large heating area, covering common size chip
4, automatic cooling system using water cooling, cooling rate uniformity,is used to get a better bonding effect
5, adjustable automatic pressure according to different material withdifferent pressure control
6, uses a unique vacuum pressing systems and ensuring chip success ratewithout damaging the case substantially increases bond
